Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
Remove, replace, and re work components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations.
Conduct X ray inspection of re worked bottom terminated parts, evaluate solder joint integrity, and document findings.
Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications.
Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply build to print practices where required.
Minimum 5 years of hands on SMT/TH solder assembly in a high mix, low volume environment (aerospace, defense, or similar).
Additional certification (e.g., IPC A 610, IPC J STD 001)
Ability to sit for extended periods and lift to 25 lb (11 kg).
Vision acuity (or corrective lenses) sufficient for detailed microscope work.
Custom Fields:
Name: Security Clearance
Value: None
Name: Allow Expenses
Value: No
Name: Security Clearance Comments
Value: None
Name: Work Schedule
Value: 4/10-1st Shift
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.