Perform high mix, low volume assembly of SMT and through hole components on complex printed circuit boards (PCBs).
Execute removal, replacement, and repair of bottom terminated components (QFNs, BGAs, LGAs) using hot air pencils, hot plates, and other rework tools.
Conduct precise reflow, pre heat, and cooling cycles to meet component specific thermal profiles.
Operate and maintain X ray inspection equipment to evaluate solder joints on hidden pads and verify rework quality.
Interpret engineering drawings, work orders, and Bill of Materials (BOM) to ensure correct component placement and orientation.
Perform in process quality checks (visual, AOI, X ray) and document results per quality system requirements.
Troubleshoot solder related defects (e.g., tombstoning, voids, solder bridges) and implement corrective actions.
Maintain ESD controlled environments; follow all safety and compliance procedures.
Contribute to continuous improvement initiatives, suggesting tooling upgrades or process optimizations.
Operator must be willing to work under a microscope for long periods of time while inspecting and working on PWBs
Custom Fields:
Name: Allow Expenses
Value: No
Name: Security Clearance Comments
Value: None
Name: Security Clearance
Value: None
Name: Work Schedule
Value: 4/10-2nd Shift