Seeking a detail oriented SMT Assembler with proven experience operating pick and place equipment and a strong grasp of IPC standards. The incumbent will assemble printed circuit boards (PCBs) using surface mount technology, perform in process inspections, and ensure that every product meets our rigorous quality and reliability requirements.
Load and unload boards, feeders, and solder paste printers on automated pick and place machines (e.g., Juki, Fuji, Samsung).
Set up component trays, verify part numbers, and adjust machine parameters (placement speed, vision settings, nozzle height).
Perform manual rework and hand soldering for components that require special handling (BGAs, QFNs, fine pitch).
Conduct visual and automated inspections (AOI, SPI) to detect defects such as bridges, tombstoning, mis placements, solder shorts, and insufficient wetting.
Apply IPC A 610 (Acceptability of Electronic Assemblies) and IPC J STD 001 (Soldering Materials) throughout the assembly process.
Perform routine cleaning, nozzle checks, and preventive maintenance on pick and place machines and reflow ovens.
Troubleshoot equipment alarms, feeder jams, and placement accuracy issues.
Keep work area organized and adhere to 6S principles.
High school diploma or GED; technical/associate degree in electronics manufacturing or related field preferred.
Minimum 2 years of hands on SMT assembly in a high mix, high volume production environment.
Proficient with automated pick and place equipment (setup, calibration, troubleshooting).
Strong understanding of SMT component families (0201 1206, QFN, BGA, CSP, FCBGA).
Ability to use microscopes, AOI, SPI, and visual inspection techniques to identify and document defects.
Ability to use microscopes, AOI, SPI, and visual inspection techniques to identify and document defects.
Experience with mixed technology boards (both SMT and through hole).
Knowledge of lead free, RoHS compliant processes and cleaning methods.
Ability to stand for long periods and sustain moderate physical activity.
Manual dexterity to handle fine pitch components and small tools.
Ability to lift up to 25 lb (e.g., PCB trays, tooling).
Custom Fields:
Name: Security Clearance Comments
Value: None
Name: Work Schedule
Value: 4/10-2nd Shift
Name: Allow Expenses
Value: No
Name: Security Clearance
Value: None
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.
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Load and unload boards, feeders, and solder paste printers on automated pick and place machines (e.g., Juki, Fuji, Samsung).
Set up component trays, verify part numbers, and adjust machine parameters (placement speed, vision settings, nozzle height).
Perform manual rework and hand soldering for components that require special handling (BGAs, QFNs, fine pitch).
Conduct visual and automated inspections (AOI, SPI) to detect defects such as bridges, tombstoning, mis placements, solder shorts, and insufficient wetting.
Apply IPC A 610 (Acceptability of Electronic Assemblies) and IPC J STD 001 (Soldering Materials) throughout the assembly process.
Perform routine cleaning, nozzle checks, and preventive maintenance on pick and place machines and reflow ovens.
Troubleshoot equipment alarms, feeder jams, and placement accuracy issues.
Keep work area organized and adhere to 6S principles.
High school diploma or GED; technical/associate degree in electronics manufacturing or related field preferred.
Minimum 2 years of hands on SMT assembly in a high mix, high volume production environment.
Proficient with automated pick and place equipment (setup, calibration, troubleshooting).
Strong understanding of SMT component families (0201 1206, QFN, BGA, CSP, FCBGA).
Ability to use microscopes, AOI, SPI, and visual inspection techniques to identify and document defects.
Ability to use microscopes, AOI, SPI, and visual inspection techniques to identify and document defects.
Experience with mixed technology boards (both SMT and through hole).
Knowledge of lead free, RoHS compliant processes and cleaning methods.
Ability to stand for long periods and sustain moderate physical activity.
Manual dexterity to handle fine pitch components and small tools.
Ability to lift up to 25 lb (e.g., PCB trays, tooling).
Custom Fields:
Name: Security Clearance Comments
Value: None
Name: Work Schedule
Value: 4/10-2nd Shift
Name: Allow Expenses
Value: No
Name: Security Clearance
Value: None
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.