Microelectronics Wire Bonder
Seeking Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
Job Details:
• Location: Chelmsford, MA
• Shift: Day shift, Full-Time (M-TH) 4:00 PM - 2:30 AM
• Hours: 4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
What You'll Do:
• Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
• Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
• Read and interpret assembly process/work instructions and work instruction processes.
• Work with microscopic to large components that may require visual magnification for entire shift.
• Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
• Maintain accurate data entry related to production processes.
• Collaborate with teams members to improve throughput and continuous improvement.
What We're Looking For:
• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
• Familiarity with manual bonding equipment and with automatic bonding equipment.
• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
• Strong attention to detail and ability to work in a fast-paced environment.
• Ability to follow written and verbal instructions.
• Ability to learn J-STD-001 and/or IPC-A-610.
• Knowledge of ESD procedures and test equipment.
• High school diploma or GED required.
• Preemployment Drug, Background and Interim Clearance required
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.
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Seeking Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
Job Details:
• Location: Chelmsford, MA
• Shift: Day shift, Full-Time (M-TH) 4:00 PM - 2:30 AM
• Hours: 4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
What You'll Do:
• Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
• Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
• Read and interpret assembly process/work instructions and work instruction processes.
• Work with microscopic to large components that may require visual magnification for entire shift.
• Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
• Maintain accurate data entry related to production processes.
• Collaborate with teams members to improve throughput and continuous improvement.
What We're Looking For:
• Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
• Familiarity with manual bonding equipment and with automatic bonding equipment.
• Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
• Strong attention to detail and ability to work in a fast-paced environment.
• Ability to follow written and verbal instructions.
• Ability to learn J-STD-001 and/or IPC-A-610.
• Knowledge of ESD procedures and test equipment.
• High school diploma or GED required.
• Preemployment Drug, Background and Interim Clearance required
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.